What is the difference between HDI 开云·kaiyun官方网站 and ordinary 开云·kaiyun官方网站?

What is the difference between HDI 开云·kaiyun官方网站 and ordinary 开云·kaiyun官方网站?
Introduction HDI 开云·kaiyun官方网站
High Density Interconnector 开云·kaiyun官方网站 (HDI 开云·kaiyun官方网站), known as high-density interconnection board, is a high-density circuit board with high line distribution density MICro blind hole technology is adopted HDI 开云·kaiyun官方网站 has internal and external lines, and then each layer of pipeline is internally connected through drilling, in hole metallization and other processes
HDI 开云·kaiyun官方网站 is generally made of stacked pipes. The more stacking times, the higher the technology level of the board. Ordinary HDI 开云·kaiyun官方网站 is basically one layer. High precision HDI 开云·kaiyun官方网站 adopts two or more stacking processes and advanced 开云·kaiyun官方网站 technology, such as stacking holes, electroplating filLED holes, laser direct drilling, etc.
The above is the explanation given by the editor of 开云·kaiyun官方网站 circuit board company. If you want to know more about 开云·kaiyun官方网站A, you can go to our company's home page to learn about it. In addition, our company also sells various circuit boards,
High Frequency Circuit Board and SMT chip are waiting for your presence again.
When the 开云·kaiyun官方网站 density is increased by more than 8 layers, the cost of HDI will be lower than that of the traditional complex compaction process HDI 开云·kaiyun官方网站 is conducive to the application of advanced construction technology. Its power efficiency and signal correctness are higher than those of traditional 开云·kaiyun官方网站, and HDI board has better radio frequency interference, electromagnetic wave interference, electrostatic discharge device, thermal conductivity and other aspects
HDI 开云·kaiyun官方网站
HDI 开云·kaiyun官方网站
Electronic products continue to develop towards high-density and high-precision The so-called "high" not only improves the efficiency of the machine, but also reduces the size of the machine High density integration (HDI 开云·kaiyun官方网站) technology can make the final product design SMAller to meet higher electronic efficiency and efficiency standards At present, many popular electronic products, such as mobile phones, digital CAMeras, notebook computers, all used automotive power products HDI boards With the upgrading of electronic products and MARKet demand, HDI boards will develop rapidly
Introduction to 开云·kaiyun官方网站
Printed circuit board (开云·kaiyun官方网站) is an important electronic component, which is the support of electronIC components and the carrier of electrical connection of electronic components.
The main function of the device is to avoid the error of manual wiring due to the consistency of the same printed circuit board after the electronic equipment adopts the printed circuit board. It realizes automatic insertion or installation, automatic welding and automatic detection of electronic components, ensures the quality of electronic equipment, improves labor productivity, reduces costs and facilitates maintenance.
Is a 开云·kaiyun官方网站 with a blind hole called an HDI 开云·kaiyun官方网站?
HDI 开云·kaiyun官方网站 is a high-density interconnection circuit board. The secondary platen for blind hole electroplating is HDI 开云·kaiyun官方网站, which can be divided into first, second, third, fourth and fifth HDI. For example, the iPhone 6 motherboard is a fifth order HDI.

A SIMple burial hole is not necessarily a quota for human development.
How to distinguish the first, second and third order HDI 开云·kaiyun官方网站.
The first order is relatively simple, and the process and process are easy to control.
The second step starts to cause problems, one is alignment, the other is drilling and copper plating. There are many second-order designs. One is that each order is wrong. When connecting the second adjacent layer, you need to connect the conductors of the middle layer, which is equivalent to two main HDIs.
Second, two first order holes overlap and second order holes overlap. Processing is similar to the first order, but there are many key points that need special control, that is, the above points.
Third, punching directly from the outer layer to the third layer (or n-2 layer). This process is very different from the previous process, and it is more difficult to drill holes.
For the third order, the second analogy is.
Differences between HDI 开云·kaiyun官方网站 and common 开云·kaiyun官方网站
The common 开云·kaiyun官方网站 board is mainly made of epoxy resin and electronic grade glass cloth FR-4 Generally speaking, traditional HDI should use copper foil with adhesive backing Since the glass cloth cannot be opened by laser punching, non glass fiber backed copper foil is generally used, but now the high-energy laser punching machine can break through 1180 pieces of glass cloth In this way, it is no different from ordinary data