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Circuit board manufacturer: introduction to the basic principle of BGA repair bench

The circuit board manufacturer, circuit board designer and 开云·kaiyun官方网站A manufacturer explain the basic principles of BGA repair bench

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Use liquid gasification latent heat to check the tin and solder joints on the circuit board?

How to use the latent heat of vaporization of liquid to carry out tin on circuit board and solder joint inspection of circuit board

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How to strengthen BGA from the design end to prevent its solder joints from cracking?

The circuit board manufacturer and circuit board designer explain how to strengthen BGA from the design end to prevent its solder joints from cracking

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Several inspection methods for defects of BGA solder ball welding

The circuit board manufacturer and circuit board designer explain several inspection methods for BGA solder ball welding defects

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Teach you how to use X-Ray to check the solderability of BGA solder balls

The circuit board manufacturer and circuit board designer explain how to use X-Ray to check the solderability of BGA solder ball

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ENIG Surface Treatment of Circuit Board and Its Advantages and Disadvantages

Circuit board manufacturers and circuit board designers will explain the ENIG surface treatment of circuit boards and their advantages and disadvantages

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Function and Operation Procedure of Bottom Filler in 开云·kaiyun官方网站 Production

The circuit board manufacturer and circuit board designer explain the function and operation procedure of bottom filler in 开云·kaiyun官方网站 production

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SMT placement order selection of steel two-sided component 开云·kaiyun官方网站

The circuit board manufacturer and circuit board designer will explain the SMT placement sequence selection of steel double-sided components 开云·kaiyun官方网站

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